iPhone 7 Release Date and Rumors: Apple May Develop 'Unhackable' Model After FBI Fiasco

By Jenn Loro - 02 Apr '16 12:11PM

Previous roundups on the yet-to-be-released iPhone 7 mentioned a number of interesting add-ons and makeovers that make the iconic smartphone a wonderful technological piece of creation. These changes reportedly include a slew of advanced features such as built-in Touch ID, wireless charging, wireless headphone (after ditching its 3.5mm headphone jack), and most recently a purported attribute that makes iPhone 7 a device like no other: being unhackable.

As mentioned by Parent Herald, work on an unhackable iPhone is currently in progress after the Cupertino-based tech giant's recent standoff with the FBI. In recent months, Tim Cook has stood his ground not to give in to the agency's demand of creating a backdoor software version to gain access to one of San Bernardino attacker's iPhone.

With other Silicon Valley giants behind him the Apple exec, FBI appeared to have backed down (for now) and looked for other ways to get what they're looking for.

Meanwhile, the new flagship is slated for release this September following Apple's customary habit of making ceremonial and dramatic unveiling of their products during fall since 2012 as reported by Bustle.  With this in mind, people are expected to save a couple of dollars to splurge on the new device.

Aside from the a slew of features mentioned above, there are speculations that iPhone 7 will come in an ultra-thin design reportedly 1mm slimmer than its iPhone 6 predecessor a report from the Albany Daily Star suggests making the phone the sleekest iPhone to date. The ultra-thin war will probably become an ongoing trend among mobile handsets in the foreseeable future.

In a related development, the desire for slim devices has become quite an obsession by Apple and its leading rivals in the industry. The Silicon Valley giant is reportedly using what tech observers call as 'fan-out packaging' which would enable the company to rid the device some millimeters off its chassis.

"Fan-out packaging technology essentially makes certain chips more powerful and efficient while also making them smaller," Tech Insider reported.

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